| PART |
Description |
Maker |
| XC17256EPCG20C XC1765ELSOG8C XC4020XL/XLA XC4020E |
XC17256EPCG20C 256K X 1 CONFIGURATION MEMORY, PQCC20
XC1765ELSOG8C 64K X 1 CONFIGURATION MEMORY, PDSO8
XC1700E series are available in 5V and 3.3V versions
XC1700E series are available in 5V and 3.3V versions
|
Xilinx, Inc.
|
| PS070 PS050 PS052 |
PowerCal 2 Calibration Platform
PowerCal⑩ 2 Calibration Platform
|
MICROCHIP[Microchip Technology]
|
| M85049-82-08N02 M85049-83-08N02 M85049-84-08N02 M8 |
Banding Backshells
|
Glenair, Inc.
|
| 600-067 600-068 |
Pneumatic Banding Tools
|
Glenair, Inc.
|
| 527-108MP3 527-108MP2 527-108MP6 527-108MP5 527-10 |
EMI/RFI Banding Backshell
|
Glenair, Inc.
|
| SNAP-FUSE7.5AB SNAP-TEX-REC10N SNAP-TEX-DRC10 SNAP |
Factory Mutual-approved versions available
|
List of Unclassifed Man...
|
| S1724BBBA S1724BDBA S1724CBBA S1724CDBA S1724DDBA |
Optical amplifier platform, erbium-doped fiber amplifier. P0=16.0 dBm. Connector FC/PC. Without heat sink.
Optical Amplifier Platform1724-Type Eribium-Doped Fiber Amplifier(S and V Series)
Optical Amplifier Platform/1724-Type Eribium-Doped Fiber Amplifier(S and V Series)
Optical Amplifier Platform,1724-Type Eribium-Doped Fiber Amplifier(S and V Series) 光放大器平台,1724 -型Eribium铒光纤放大器（S和V系列
BOARD INTERFACE KGZ/GMS 0-25%
Optical amplifier platform, erbium-doped fiber amplifier. P0=13.0 dBm. Connector FC/PC. Without heat sink.
|
AGERE[Agere Systems]
ERICSSON
Austin Semiconductor, Inc
|
| 550T033M 550S033M |
D-Subminiature Dual Banding Split Backshell
|
Glenair, Inc.
|
| 557T386M 557E386M 557B386M 557S386M |
EMI/RFI Banding Backshell Assembly
|
Glenair, Inc.
|
| 483-02 |
Electronic versions are uncontrolled except when accessed directly
|
ON Semiconductor
|
| 751BD-01 |
Electronic versions are uncontrolled except when accessed directly
|
ON Semiconductor
|
| 517BR-01 |
Electronic versions are uncontrolled except when accessed directly
|
http://
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